KDS DSX321G PDF
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Also, no serial bubble is observed by Fluorocarbon tests. C 10 s s 60 s Total time: Further,parts shall be solderd on substrate, fixed Aluminum materials about g. C Transport Time min ?
Please keep it in the place which direct rays do not hit and dew condensation does not generate. However please consult in advance about other washing liquid. C and no abnormal appearance shall be observed.
C and no abnormality shall be observed in external appearance and sealing tightnen and others shall be based on ET of EIAJ.
Underfilling Material for DSXG Types,KDS considers underfilling material such as heat-cured resin would not affect the characteristics of the DSXG crystal mounted, however, we recommend the crystal be tested and checked in such a case prior to use so that there are the possibility that the crystal may have a cap off or a crack in the ceramic base. After all products were packaged, must remain more than twenty dsx321b or mm empty area, which should be sealed by cover-tape.
C 30min 1 cycle Apply the following pressure Weight: The empty embossed area which are sealed by cover-tape must remain more than lds. C 3cycles 18times drop from cm heights to concrete. Mount the specimen on substrate.
宁昊电子KDS DSXG 8MHZ规格书_百度文库
Rsx321g when too much shock is added according to a certain cause, the use after a characteristic check is recommended. Glass Epoxy 1 cycle: Please refrain from forming patterns between crystal land pattern’s since there is a possibility to cause crack in base.
The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. Please use it below with the krs specified on a catalog and specifications. In the upper and lower part and the opening in box it shall be protected products using aircushion sheets.
【DSX321G KDS】Electronic Components In Stock Suppliers in 2018【Price】【Datasheet PDF】USA
Be sure to have a mounting test in advance by using the actual mounting machine and check that the dsx3221g of the products are not damaged by the automatic mounting. Although the check about ultrasonic washing is performed, since it is an examination with a simple substance, the check for the second time by the use state is recommended.
C perform the attached Reflow conditions to reference. It is a guaranteed term because it obtains an excellent soldering: In the process where the boad is warped, such as board separation process, be careful that the warping does not influence the characteristics and soldering of crystal products.
M Plating material of a terminal.
Sine waves of 1. Since mounting by Ultrasonic welding and processing have a possibility of an excessive vibration spreading inside a crystal resonator and becoming the cause of characteristic deterioration and not oscillating, it does not recommend. A clearance between the soldering terminal portion and a print circuit board side should be less than 0. C and no abnormality shall be observed in external appearance and xsx321g tightness and others shall be based on ET of EIAJ.
Avoid using the product at temperature higher than specified. Reflow soldering shall be allowed only 3 times.